Galaxy S9 Could Steal iPhone X's Biggest Feature

Gwen Vasquez
January 5, 2018

The processor is in mass production and is expected to be launched with Samsung's upcoming flagship smartphone Galaxy S9 and Galaxy S9+. And based on some of the new features listed in the announcement, it seems Samsung has built its latest processor with a couple of the iPhone X's signature features in mind.

The chip's architecture widens the pipeline and improves cache memory, offering a two-fold improvement in single-core performance, while multi-core performance is around 40% better than Samsung's previous Exynos chip. That includes recognizing faces as well, and Samsung explicitly mentions the technology in the context of scanning faces in 3D for the purposes of unlocking devices and enabling face tracking filters.

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As detailed earlier, the Exynos 9810 is made on Samsung's 10nm LPP FinFET manufacturing process, which allowed Samsung to boost performance by around 10 percent or lower power consumption by 15 percent. The octa-core CPU has four powerful 3rd generation custom cores capable of reaching 2.9 gigahertz (GHz) and additional four cores, optimized for efficiency. What the Exynos 9810 brings is third-generation custom CPU, faster gigabit LTE modem and better image processing with deep learning-based software. Samsungs claims that the new technology will help the processor in recognising people more accurately and for fast image searching. It also features firewalls that isolate internal sub-systems from each other. Numerous features it promises look suspiciously like features we've seen before - in the iPhone X. The Exynos 9810 features a dual-ISP (Image Signal Processor) that support up to 4 image sensors such as a dual-camera in the rear along with a camera and an iris sensor in the front. The SoC supports up to 24-megapixel front and rear cameras, or up to 16-megapixel dual cameras. Samsung says the new SoC supports 120 fps slow motion video recording in UHD resolution. This gives Exynos 9810 an edge over the Qualcomm's Snapdragon 845 SoC and Kirin 970 in terms of modem performance, at least on paper. These new SoCs have been created to power the next-generation Android flagship devices that will launch in 2018.

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